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Bussmann(R)
SurgX(R) ESD Suppressors
Surface Mount Transient Voltage Suppressors
SOT23ESD-A
A Unique Approach to ESD Protection SurgX(R) suppressors by Bussmann provide electrostatic discharge (ESD) protection in mobile communications, data processing, and many other electronic applications. They are ideally suited for low voltage, high data rate microprocessor-based circuits. The SurgX products utilize unique polymer-based materials for the suppression of the fast transient voltages caused by ESD, in conformance with IEC 61000-4-2 and MIL-STD-883C. Features: * Ultra-low Capacitance & Leakage Current * Fast Response Time * Withstands up to 15kV @ 45A ESD Pulse * Bidirectional
Dimensional Data
1.49 (.059)
3
0.56 (.022) 0.55 (.022)
2.20 (.087) 0.55 (.022) 1 0.30 (.012) 1.90 (.075) 2.98 (.117) 2 0.56 (.022)
3
1.09 - .10 .010 (.043+ .004) -
+ .25
1
2
Electrical Characteristics Continuous Operating Voltage Clamping Voltage1,2 Peak Voltage1 Capacitance
3
24V maximum Typical Transient Response
Potential Threat Voltage Voltage Across TVS Clamp Voltage
40V typical, 60V maximum 150V typical, 300V maximum 1pF typical 100nA max 30A maximum
Peak Voltage
Leakage Current4 Peak Current1,2
1
ESD Withstand 20 pulses minimum Notes: 1. Per IEC 61000-4-2, 30A @ 8kV, contact discharge. 2. Measurement made 30nS after initiation of pulse. 3. Measured @ 1MHz. 4. Measured at 24 Vdc.
Peak Current
Current Through TVS
Initiation of ESD Event
TVS Triggers
12-28-98 SB98107
Rev. A
Form No. SOT23ESD-A Page 1 of 2 BIF Doc #3604
Bussmann(R)
SurgX(R) ESD Suppressors
Surface Mount Transient Voltage Suppressors
SOT23ESD-A
Typical Circuit and Generalized V-I Curve Vt = Trigger Voltage Vc = Clamping Voltage
IT
Rs
IT
Protected Load
- Vt
+ VL -
- Vc Vc Vt
VL
Pulse Generator
Packaging Information: * Tape and Reel: Standard 8mm tape, in compliance with EIA-RS481 (equivalent to IEC 286, Part 3). * Code: TR1 = 2,000 pieces on tape on a 178mm reel. SP1 = 10 pieces on tape in a plastic box. EX: TR1/SOT23ESD-A denotes 2,000 pieces on tape.
Mechanical Specifications: * Substrate: Ceramic * End termination finish: Nickel barrier (3.88 -4.3m), followed by 90/10 tin - lead (5.1 - 10.2m) * ESD barrier: SurgX polymeric material Environmental Specifications: * Dry heat: 96 hours @ 85C * Humidity: 96 hours @ 85% RH, 60C * Thermal shock: -55C to 85C, 1 hour cycle, 10 cycles * Vibration: MIL-STD202, Method 204, Test Condition C, (55 to 2000 Hz, 10Gs) * Solderability: withstands 60 seconds above 200C, 260C maximum * Solder leach resistance and terminal adhesion per EIA-576 Recommended Land Pattern mm (in.)
P0 D0
P2
E
A0
F W B0
P1
D1
Carrier Dimensions - mm (in.)
W F E P2 P0 P1 A0 B0 D0 D1 8.0 0.1 (.315 .004) 3.5 0.05 (.138 .002) 1.75 0.1 (.069 .004) 2.0 0.05 (.079 .002) 4.0 0.1 (.157 .004) 4.0 0.1 (.157 .004) 3.20 0.1 (.126 .004) 2.44 0.1 (.096 .004) 1.5 + 0.1 / -0.0 (.059 + .004 / -.000) 1.00 .25 (.039 .001)
2.20 (.087)
1.40 (.055)
0.90 .10 (.035 .004) 0.95 (.037)
The only controlled copy of this BIF document is the electronic read-only version located on the Bussmann Network Drive. All other copies of this document are by definition uncontrolled. This bulletin is intended to clearly present comprehensive product data and provide technical information that will help the end user with design applications. Bussmann reserves the right, without notice, to change design or construction of any products and to discontinue or limit distribution of any products. Bussmann also reserves the right to change or update, without notice, any technical information contained in this bulletin. Once a product has been selected, it should be tested by the user in all possible applications. SurgX is a registered trademark of SurgX Corporation.
12-28-98 SB98107
Rev. A
Form No. SOT23ESD-A Page 2 of 2 BIF Doc #3604

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